Hand Plasma MyPL

MyPL® Series is surface treatment system.
Provide excellent solution with various material and shape with surface modification, cleaning, ashing, etching, reduction, sterilization, functional treatments.

MyPL® can build In-line system without modification of existion system.

Improve reliability, adhesive strength, durability through Plasma pre-treatment invarious industrial process.

Features/Benefits

• Within a few minutes Treatment completed
  
• Low running cost
  (Gas consumption, low power using)
  
• Can treat the wanted area of sample
  
• rmity > 90%
  
• No need modification of existing system
  
• Easy to move the system
  
• Glow / Direct Plasma source patented
  
• Apply to In-Line process
  
• Less limit in material shape and size
  
• Apply to both Metal/Non-metal sample(Control Arc)
• Eco product (Pass Ozone/NOx Test)
• Electrical safe (hold sample by hand)
• Ashing and remove PR
  
• Pre-treatment for Die attach, Molding, Wire Bonding for improve bondability through cleaning organic contaminant
  
• Cleaning/Surface Modification
  - Film (PET, PVDF, PI)
  - Glass (Bare glass, ITO glass)
  - Wafer/PCB/FPCB
  - Flip-chip/CSP/BGA board
  - Polymer (Si rubber, PMMA)
  - Metal (Cu, Ni, Steel)

Surface Modification

Remove Organic Contaminant

MyPL Performance Data